Material information press release about share exchange between IET and EZconn Corporation.
IntelliEPI Inc.（Cayman）(IET, TPEx: 4971) and EZconn Corporation (EZconn,TWSE: 6442) today (December 4, 2025) announced that their respective Boards of Directors have approved a strategic share exchange transaction intended to strengthen the companies’ long-term strategic partnership. Under the approved structure, both parties will subscribe to newly issued shares of the counterparty through capital increases. The agreed exchange ratio is 5.1 shares of IET common stock for 1 share of EZconn common stock. Upon completion of the transaction, IET will hold approximately 1.79% of the total common shares in EZconn, and EZconn will hold
approximately 15.26% of the total common shares in IET.
IET specializes in the research, development, and production of III-V compound semiconductor epitaxial wafers using proprietary Molecular Beam Epitaxy (MBE) technology. Its products, including Indium Phosphide (InP), Gallium Arsenide (GaAs), and Gallium Antimonide (GaSb), are widely utilized in high-speed optical communication, wireless communication, defense sensing, and quantum computing. EZconn is a globally recognized manufacturer of optical communication components and high-frequency connectors, covering active optical components, passive optical components, and RF high-frequency connectors. EZconn is a key supplier of optical components for large-scale data centers and has recently intensified its focus and technological development in the field of Silicon Photonics (SiPh) and Co-Packaged Optics (CPO).
This share-exchange alliance marks a significant milestone as IET extends its position from an upstream epitaxial material supplier into the mid- and downstream optical component and module sectors. This vertical integration will accelerate strategic deployment in the AI data center and SiPh sectors.
Leveraging InP Leadership to Seize AI Data Center Opportunities Amid rapid transformation driven by AI computing demand, IET maintains a world-leading position in MBE epitaxy—particularly in InP HBT and high-speed PIN/APD products. EZconn, as a key supplier of optical passive components to global data centers, offers IET direct access to end-customer specifications, enabling shorter development cycles, faster product iteration, and accelerated commercialization. Through deeper vertical integration, IET will gain clearer visibility into system-level performance requirements, significantly enhancing its ability to address next-generation high-speed optical applications.
Moreover, IET will benefit from EZconn’s extensive customer base and longstanding presence across data centers, 5G communications, networking infrastructure, low- earth-orbit satellites, aerospace, and defense. This collaboration broadens IET’s routes to market and scales its operational capacity. As demand for InP epitaxy continues to grow in AI-driven data center infrastructure, EZconn’s entrenched market position will allow IET to capture a greater share of the high-speed epitaxial wafer market.
Jointly Pioneering the Next Generation of CPO Technology Looking further ahead to next-generation Co-Packaged Optics (CPO) technology, the two companies will engage in deep technical collaboration. By integrating IET’s high-performance laser epitaxy with EZconn’s precision optical engineering capabilities,the companies aim to jointly deliver end-to-end silicon photonics CPOsolutions—from epitaxial growth to module-level integration—positioning themselves to capture substantial opportunities in AI-era CPO and high-frequency,high-speed applications.
Taishin Securities’ Capital Markets Division is appointed as the exclusive financial advisor for this share swap, providing strategic planning, structural design, and transaction support to facilitate smooth execution. Following the completion of the share-swap alliance, IET and EZconn will become long-term strategic partners, leveraging their complementary strengths to enhance operational performance and create long-term shareholder value.